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2025年先进半导体与通信国际学术会议

2025 International Conference on Advanced Semiconductors and Communications

ICASC
发布时间:2024-09-24 14:54:47 人浏览过
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  • 大会简介

    2025年先进半导体与通信国际学术会议(ICASC 2025)将于2025年5月16-18日在中国-杭州举办。会议旨在为全球学术界和工业界的研究人员、工程师和专家提供一个交流最新研究成果、分享前沿技术和探讨未来发展趋势的平台ICASC 2025 将涵盖先进半导体材料、器件与技术、无线通信、集成电路设计、信号处理、物联网、人工智能与大数据等多个研究领域。会议将包括主题演讲、专家论坛、学术论文报告和海报展示,为与会者提供丰富的学术交流机会。

    我们诚邀来自学术界和工业界的杰出专家共同探讨当今半导体与通信领域面临的挑战与机遇,推动相关技术的进步与应用。期待您的参与,与我们一起塑造半导体与通信的未来!

    征稿主题

    ■ 半导体制造与工艺技术

    • 极紫外光刻(EUV)技术
    • 3D集成电路及其制造工艺
    • 先进封装与测试技术
    • 半导体制造工艺优化与自动化

    ■ 量子计算与量子通信

    • 量子点与量子比特控制
    • 量子密码学与安全通信
    • 量子网络与互联网
    • 量子计算硬件与芯片设计

    ■ 半导体材料与器件

    • 新型半导体材料(如碳化硅、氮化镓和二维材料)
    • 先进CMOS技术
    • 高效功率半导体器件
    • 纳米尺度电子器件

    ■ 传感器与MEMS技术

    • 集成微机电系统(MEMS) 智能传感器与纳米传感器
    • 生物电子设备与传感技术
    • 环境监测与健康管理传感器

    ■ 智能传感与物联网(IoT)

    • 物联网节点与网关设计
    • 物联网安全与隐私
    • 边缘计算与边缘智能
    • 低功耗广域网(LPWAN)

    ■ 移动通信技术

    • 移动边缘计算(MEC)
    • 网络切片技术
    • 弹性网络与自适应通信
    • 车联网(V2X)技术

    ■ 数据处理与传输

    • 高速数据链路技术
    • 先进编码与调制技术
    • 数据压缩与传输优化
    • 容错与纠错技术

    包括但不限于以上主题,其他相关主题亦可投递

    论文出版

    本会议所有的投稿都必须经过2-3位组委会专家审稿,经过严格的审稿之后,最终所录用的论文将被递交出版社,见刊后由出版社整理提交、EI Compendex、Scopus检索。

    投稿须知:

    论文需是全英文稿件,且未在国内外学术期刊或会议发表过。参会做报告交流不发表论文的作者只需提交摘要。

    论文需按照会议官网的模板排版,不得少于5页。模板下载

    作者可通过CrossCheck, Turnitin或其他查重系统自费查重,否则由文章重复率引起的被拒搞将由作者自行承担责任。涉嫌抄袭的论文将不被出版。

    参会信息

    会议采用在线方式进行注册

    1. 听众参会:不投稿仅参会听会,无任何展示;

    2. 口头报告:演讲10-15分钟,需提前准备演讲PPT;

    3. 海报展示:报名时,需提供一份A1竖版尺寸的彩色电子版的海报(JPG格式);

    注:口头/海报参会均可开具口头参会证明/海报展示证明

    - About ICASC 2025 -

    2025 International Conference on Advanced Semiconductors and Communications

    2025 International Conference on Advanced Semiconductors and Communications (ICASC 2025) will be held on May 16-18 2025 in Hangzhou China. It is set to be a premier event that brings together leading researchers industry professionals and academics from around the globe to explore the latest advancements in semiconductor technology and communication systems. This conference aims to facilitate the dissemination of cutting-edge research innovative methodologies and technological breakthroughs in the fields of semiconductor devices integrated circuits and communication networks.

    ICASC 2025 will feature keynote speeches from renowned experts technical sessions encompassing a broad range of topics and interactive workshops designed to foster collaboration and knowledge exchange. The conference will cover significant themes such as the design and fabrication of advanced semiconductor materials emerging communication techniques including 5G and beyond optoelectronics and the integration of artificial intelligence in communication systems.

    Participants will have the opportunity to engage in discussions and network with peers to drive forward the frontiers of semiconductor technology and improve communication infrastructure worldwide. We invite researchers and practitioners to submit their original work and contribute to the development of innovative solutions that address the challenges faced in these rapidly evolving fields. Join us in advancing the future of technology at ICASC 2025.

    Important Dates

    Full Paper Submission Date

    March 20 2025

    Registration Deadline

    April 15 2025

    Final Paper Submission Date

    May 2 2025

    Conference Dates

    May 16-18 2025

    Call For Papers

    2025 International Conference on Advanced Semiconductors and Communications (ICASC 2025) will bring together leading researchers engineers and scientists in the domain of interest from around the world.

    The topics of interest for submission include but are not limited to:

    ■ Semiconductor manufacturing

    • Extreme ultraviolet lithography ( EUV ) technology
    • 3D integrated circuit and its manufacturing process
    • Advanced packaging and testing technology
    • Semiconductor manufacturing process optimization and automation

    ■ Quantum computation and quantum communication

    • Quantum dot and quantum bit control
    • Quantum cryptography and secure communication
    • Quantum Networks and the Internet
    • Quantum computing hardware and chip design

    ■ Semiconductor materials and devices

    • New semiconductor materials ( such as silicon carbide gallium nitride and two-dimensional materials )
    • Advanced CMOS Technology
    • High efficiency power semiconductor devices
    • Nanoscale electronic devices

    ■ Sensor and MEMS technology

    • Integrated micro-electro-mechanical system ( MEMS ) smart sensors and nano-sensors
    • Bioelectronic equipment and sensing technology
    • Environmental Monitoring and Health Management Sensors

    ■ Intelligent sensing and Internet of Things (IoT)

    • Internet of Things node and gateway design
    • Internet of things security and privacy
    • Edge computing and edge intelligence
    • Low Power Wide Area Network ( LPWAN )

    ■ Mobile communication technology

    • Mobile Edge Computing ( MEC )
    • Network slicing technology
    • Elastic network and adaptive communication
    • Internet of Vehicles ( V2X ) technology

    ■ Data processing and transmission

    • High speed data link technology
    • Advanced coding and modulation technology
    • Data compression and transmission optimization
    • Fault tolerance and error correction technology

    Publication

    All papers both invited and contributed will be reviewed by two or three experts from the committees. After a careful reviewing process all accepted papers of ICASC 2025 will be published in the conference Proceedings and it will be submitted to EI Compendex and Scopus for indexing.

    Note: All submitted articles should report original results experimental or theoretical not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

    标签: 杭州学术会议