第七届电子工程与信息学国际学术会议
2025 7th International Conference on Electronic Engineering and Informatics
大会介绍
第七届电子工程与信息学国际学术会议(EEI 2025)将于2025年6月13日至6月15日在中国重庆隆重召开。此次会议将聚焦“电子工程”、“信息学”及“计算机科学”等领域的最新研究进展与技术创新,助力国家数字经济和智能化转型战略的推进。会议将围绕当前领域面临的重大挑战与研究方向进行深入探讨,促进理论与技术在高校和企业中的发展与应用。与会者将有机会分享最新的研究成果,扩大专业网络,并面对面交流新思想。
2024年6月28日-30日,EEI 2024在西南大学的主办下在重庆线下&线上成功召开!!!
2023年6月30日-7月2日,EEI 2023在大连交通大学&武汉大学的联合主办下在武汉线下&线上成功召开!!!
EEI 2025不仅为科研人员提供了展示其研究成果的机会,也将为参与者建立业务和研究联系,发掘未来事业上的全球合作伙伴。与会者将有机会参与高水平的学术讨论,拓展专业网络,寻求合作机会,共同推动学科发展和应用创新。我们期待您的参与,共同探索电子工程与信息学的未来发展趋势与无限可能。
征稿主题
- 智能控制理论与方法
- 数据驱动建模与控制
- 过程控制及稳定性
- 复杂系统理论与方法
- 模糊系统与模糊控制
- 智能制造与工业智能
- 信号处理与信息融合
- 智能故障检测和诊断
- 新兴技术建模和仿真
- 人机交互与知识自动化
- 网络集群与网络化控制
- 多智能体系统分布式优化
- 控制理论的其他新应用
- 机器学习和数据挖掘
- 自然语言处理与理解
- 云计算与计算智能
- 信息系统与网络安全
- 图像处理与计算机视觉
- 模式识别与人工智能
- 电路与系统
- 电磁场理论
- 光通信
- 电信工程
- 电机和电器
- 电力电子技术
- 电子信息技术
- 电子科学与技术
- 雷达信号和数据处理
- 机电传动及复合传动
- 电磁场与微波技术天线、传播和传输技术
- 复杂机电产品的设计理论与方法
- 3D加工与集成技术
- MEMS和传感器技术
- 新材料、新设备与3D互联
- 光学互连和三维光子学
- 数字系统和逻辑设计
- 计算机体系结构和VLSI
- 先进的机器人系统
- 模拟和数字电子学
- 电子设备
- 工业信息学
- 雷达工程
- 检测技术
- 图像处理
- 信息科学
- 生物信息学
- 计算机工程
- 数字信号处理
- 通信信号处理
- 信息与通信工程
- 计算机科学与技术
- 控制和计算机系统
- 卫星与空间通信
- 网络与信息安全
- 用于无线通信的信号处理
- 认知无线电和软件无线电
- 光网络与系统
- 其他相关主题
论文出版
Submit to the Conference | EI会议论文
本会议投稿经过2-3位组委会专家严格审核后,最终所录用的论文将被Conference Proceeding出版,并提交至EI Compendex、Scopus检索。
About EEI 2025
2025 7th International Conference on Electronic Engineering and Informatics
2025 7th International Conference on Electronic Engineering and Informatics (EEI 2025) will be held in Chongqing China from June 13 to June 15 2025. The conference will focus on the latest research progress and technological innovation in the fields of “electronic engineering“ “informatics“ and “computer science“ to help promote the national digital economy and intelligent transformation strategy. The conference will conduct in-depth discussions on the major challenges and research directions facing the current field and promote the development and application of theory and technology in universities and enterprises. Participants will have the opportunity to share the latest research expand professional networks and exchange new ideas face-to-face.
EEI 2025 will not only provide researchers with the opportunity to present their research results but will also provide participants with business and research connections to discover global partners for future careers. Participants will have the opportunity to participate in high-level academic discussions expand professional networks seek opportunities for collaboration and jointly promote disciplinary development and applied innovation. We look forward to your participation in exploring the future trends and possibilities of electronic engineering and informatics.
Important Dates
Full Paper Submission Date:May 20 2025
Registration Deadline:June 01 2025
Final Paper Submission Date:June 05 2025
Conference Dates:June 13-15 2025
Call For Papers
The topics of interest for submission include but are not limited to:
■ Electronic Technology
- · 3D process and integration technology
- · Substrate em
bedding and advanced flip chip packaging - · MEMS and sensor technology
- · Design and Analysis of Transmission System
- · New materials equipment and 3D interconnection
- · Wearable flexible and stretchable electronics
- · Optical interconnection and 3D photonics
- · Digital system and logic design
- · Computer architecture and VLSI
- · Network-driven multi-core chip
- · Advanced robotic system
- · Analog and digital electronics
- · Signals and Systems
■ Information and Communication
- · Electronic equipment
- · Satellite and Space Communications
- · Network and Information Security
- · Signal processing for wireless communication
- · Cognitive Radio and Software Radio
- · Optical networks and systems
- · Electromagnetic field theory
- · Antenna propagation and transmission technology
- · Optical communication
- · Radar signal and data processing
- · Other related topics
Publication
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process all accepted papers will be published in the Conference Proceedings and submitted to EI Compendex Scopus for indexing.