第二届微机电系统制造与材料技术国际学术会议
2025 2nd International Conference on Microelectromechanical Systems Manufacturing and Materials Technology
大会简介
第二届微机电系统制造与材料技术国际学术会议（MSMMT 2025）将于2025年7月11-13日在长沙举行。此次会议为广大学者和产业界提供了解学术发展趋势、拓宽研究思路、加强学术研究和探讨、促进学术成果交流和产业化合作的平台，推动微机电系统制造产业与材料工程领域的高质量发展。大会诚邀国内外高校、科研机构专家、学者，企业界人士及其他相关人员参会交流。
主办单位
上海应用技术大学
上海应用技术大学（Shanghai Institute of Technology，缩写SIT）简称“上应大”，位于上海市，是上海市重点建设的高水平地方大学，是一所具有学士、硕士和博士培养层次的应用创新型大学。学校入选上海市高水平地方大学重点建设单位、上海高等学校一流本科建设引领计划和一流研究生教育引领计划、上海市深化创新创业教育改革示范高校、上海高校课程思政整体改革领航高校、国家科技人才评价改革试点单位、国家知识产权试点高校、上海市专利工作示范单位、上海市依法治校示范校、中国科技成果转化百强高校。
支持单位
济南大学
征稿主题
- 高性能聚合物材料
- 光刻技术创新
- 光刻技术创新
- 柔性与可拉伸材料
- 微机械加工
- 石墨烯与碳纳米管
- 深反应离子蚀刻（DRIE）
- 激光微加工技术
- 智能材料
- 3D打印的材料选择与优化
- 电镀和电化学沉积
- 智能封装技术
- 纳米3D打印
- 生物相容材料
- 微流道封装
- 无线自供电MEMS封装
论文出版
所有的投稿都必须经过2-3位组委会专家审稿，经过严格的审稿之后，最终所录用的论文集将提交出版社出版，见刊后提交至 EI Compendex, SCOPUS 检索。
参会方式
1、作者参会：一篇录用文章允许一名作者免费参会；
2、主讲嘉宾：申请主题演讲，由组委会审核；
3、口头演讲：申请口头报告，时间为10分钟；
4、海报展示：申请海报展示，A1尺寸；
5、听众参会：不投稿仅参会，也可申请演讲及展示。
2025 2nd International Conference on Microelectromechanical Systems Manufacturing and Materials Technology （MSMMT 2025） will be held in Changsha China from July 11 to 13 2025.
The conference aims to provide a large platform for researchers in the field of micro electromechanical systems manufacturing and materials engineering to communicate and provide the participants with the most up-to-date scientific and technological information. The conference sincerely invites experts and scholars from domestic and foreign universities scientific research institutions business people and other related personnel to participate in the conference and exchange ideas.
Important Dates
Full Paper Submission Date：April 15 2025
Registration Deadline：May 12 2025
Final Paper Submission Date：June 10 2025
Conference Dates：July 11-13 2025
Call For Papers
The topics of interest for submission include but are not limited to:
- High Performance Polymer Materials
- Graphene and Carbon Nanotubes
- Flexible and Stretchable Materials
- Biocompatible Materials
- Smart Materials
- Lithography Innovations
- Ion Beam Etching
- Deep Reactive Ion Etching （DRIE）
- Micromachining
- Laser Micromachining Technology
- Nano 3D Printing
- Multi-Material 3D Printing
- High Resolution 3D Printing
- Picosecond Laser 3D Printing
- Material Selection and Optimization for 3D Printing
- Chemical Vapor Deposition （CVD）
- Physical Vapor Deposition （PVD）
- Atomic la
yer Deposition （ALD） - Electroplating and Electrochemical Deposition
- Surface Plasma Treatment
- Smart Packaging Technology
- Low Temperature Packaging
- Microfluidic Packaging
- Multi-chip integrated packaging
- Wireless self-powered MEMS package
Publication
Submit to Conference Proceedings （EI）
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.
*Should you have any questions or you need any information in English please contact us at: ae_msmmt@163.com
Note: All submitted articles should report original research results experimental or theoretical not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.
