It is our great pleasure to invite you to the 2025 4th International Symposium on Semiconductor and Electronic Technology 2025 （ISSET 2025） to be held in Xi‘an China July 25-27 2025 hosted by Xi‘an University of Posts and Telecommunications. ISSET 2025 will provide a forum within the international academic and engineering community in the field of Semiconductor and Electronic Technology.

At the forefront of the global STI mega-trend China has been creating an increasingly open STI environment increasing the depth and breadth of academic collaboration and building a community of innovation that benefits all. These efforts make a new contribution to globalization and the creation of a common community for the future.

The annual ISSET conference aims to gather professors researchers scholars and industrial pioneers from all over the world. ISSET is the premier forum for the presentation and exchange of past experiences new advances and research results in the field of theory and industrial applications. The conference welcomes contributions that promote the exchange of ideas and discourse between educators and researchers worldwide. The organizing committee is pleased to invite prospective authors to submit their original manuscripts to ISSET 2025.

We warmly invite you to participate in ISSET 2025 and look forward to seeing you in Xi‘an China!

Important Dates

Full Paper Submission Date：April 11  2025

Registration Deadline：May 30 2025

Conference Dates：July 25-27  2025

Call For Papers

Authors are invited to submit their contributions that will be reviewed by a committee of prominent individuals who have made significant contributions in the areas of the conferences. Topics are interested by not limited to the following:

■ Semiconductor

• · Materials Science
• · Semiconductor Spin Physics and Topological Phenomena
• · Semiconductor Nano and Devices
• · Wide/Narrow Bandgap Semiconductors
• · Compound Semiconductors
• · Magnetic Semiconductors
• · Organic Semiconductors
• · Advanced Photoresists
• · Optoelectronic and Photovoltaic Devices
• · Semiconductor Physics
• · Semiconductor Quantum Computing
• · Semiconductor Materials and Device Reliability
• · Semiconductor Manufacturing and Applications
• · Emerging Semiconductor Technologies
• · 3D Semiconductor Device Technology
• · Sensors
• · Fully Integrated Automation
• · Automated Inspection
• · …

■ Electronic Technology

• · Fiber Optics
• · Electronic Information Engineering
• · Information Security
• · Electronic Information Technology
• · Circuit Analysis and Design
• · Electronic Packaging Technology
• · Microelectronics Science and Engineering
• · Electronics and Nanoelectronics
• · Advanced Electromagnetics
• · Communication Electronic Circuits
• · Integrated Circuit Design and Integrated Systems
• · Microwave Photonic Device Physics
• · Integrated Optics
• · Micro/Nano Systems and Networks
• · Digital Signal Processing
• · Analog Computing
• · Information Processing Technology
• · …

Publication

All papers both invited and contributed will be reviewed by two or three experts from the committees. After a careful reviewing process all accepted full papers will be published by IEEE （ISBN: 979-8-3315-0362-8） and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore‘s scope and quality requirements and also submitted to EI Compendex and Scopus for indexing.

Note: All submitted articles should report original results experimental or theoretical not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academic. Hence any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.